Inductor devices – Core – Laminated type
Patent
1999-07-14
2000-07-25
Gellner, Michael L.
Inductor devices
Core
Laminated type
336217, 336232, H01F 2724
Patent
active
060941251
ABSTRACT:
A thin plate stack assembly formed by stacking a plurality of metallic thin plates and connecting the thin plates to one another, wherein each thin plate comprises a slit and formed leaf which is formed by press working to downwardly slit and form a partial area which is surrounded by an outer edge which is a part of the outer periphery of a thin plate, side edges extending by a certain length toward the inside from both ends of the outer edge, and an inner edge connecting the inside ends of the side edges to each other, and which is bent obliquely downward from said thin plate at the location of said inner edge. The side edges are cut from the thin plate, and a slit and formed hole formed behind the slit and formed leaf, and the slit and formed leaf of each thin plate is inserted into the slit and formed hole in a thin plate disposed just under the thin plate in force fitting for connecting the upper and lower thin plates to each other.
REFERENCES:
patent: 4897916 (1990-02-01), Blackburn
patent: 4963849 (1990-10-01), Kowalczyk et al.
patent: 5338996 (1994-08-01), Yamamoto
patent: 5406243 (1995-04-01), Jenkins et al.
Gellner Michael L.
Mai Anh
Wako Seiki Co., Ltd.
LandOfFree
Thin metal plate stack assembly and method of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin metal plate stack assembly and method of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin metal plate stack assembly and method of making the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1339438