Thin metal package and manufacturing method thereof

Details Thin metal package and manufacturing method thereof Thin metal package and manufacturing method thereof

2005-02-08

2005-02-08

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C257S698000

Reexamination Certificate

active

06852927

ABSTRACT:
A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material arranged at an internal space of the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface of the metal lead that is positioned at the internal space of the metal base. The internal space is held at an air-tight atmosphere. The metal lead forms a surface for attaching the metal base to a mounting board. An insulation distance between the metal lead and the metal base is at least 0.05 mm and at most 0.3 mm.

REFERENCES:
patent: 3381372 (1968-05-01), Capano
patent: 4167647 (1979-09-01), Salera
patent: 4382327 (1983-05-01), Bardens et al.
patent: 5103292 (1992-04-01), Mahulikar
patent: 5247134 (1993-09-01), Beltz
patent: 6091022 (2000-07-01), Bodin
patent: 10032453 (1998-02-01), None
patent: 2000278074 (2000-10-01), None
patent: 2000286661 (2000-10-01), None
patent: 2001211050 (2001-08-01), None

Affiliated with

Also associated with

Rating

Thin metal package and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin metal package and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin metal package and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3471015