Thin liner layer providing reduced via resistance

Details Thin liner layer providing reduced via resistance Thin liner layer providing reduced via resistance

1996-11-05

2000-01-18

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257753, 438668, 438644, H01L 2943

Patent

active

060160128

ABSTRACT:
The present invention relates to semiconductor device containing a via and a method of forming a via in a semiconductor device.

REFERENCES:
patent: 5049975 (1991-09-01), Ajika et al.
patent: 5081064 (1992-01-01), Inoue et al.
patent: 5306952 (1994-04-01), Matsuura et al.
patent: 5399530 (1995-03-01), Kenmotsu
patent: 5468342 (1995-11-01), Nulty et al.
patent: 5565708 (1996-10-01), Ohsaki et al.
patent: 5569961 (1996-10-01), Lee
patent: 5572071 (1996-11-01), Lee
patent: 5594278 (1997-01-01), Uchiyama
patent: 5625231 (1997-04-01), Huang et al.
patent: 5652464 (1997-07-01), Liao et al.
patent: 5689140 (1997-11-01), Shoda
patent: 5691571 (1997-11-01), Hirose et al.
patent: 5714804 (1998-02-01), Miller et al.
patent: 5757077 (1998-05-01), Chung et al.
patent: 5773890 (1998-06-01), Uchiyama et al.
IEEE, VMIC Conference, pp. 226-232, Jun. 12-13, 1990, T. Ohba, et al., "Selective and Blanket Tungsten Interconnection and its Suitability for 0.2-Micron ULSI".
Semiconductor International, pp. 57-61, Aug. 1994, Singer, "The Interconnect Challenge: Filling Small, High Aspect Ratio Contact Holes" (with English abstract).
Silicon Processing for the VLSI Era, vol. 2: Process Integration, pp. 246-248, Stanley Wolf, "Multilevel-Interconnect Technology for VLSI and ULSI".

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