Thin layer thermoplastic polymer bonded covalently at its surfac

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427221, 427299, 428333, 428407, 428516, 428517, 428521, 428523, 523205, 523209, 524444, 524445, 524449, 524450, 524451, 524452, 524505, 524554, B05D 700, C08K 334, C08K 300, B32B 2708

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044800053

ABSTRACT:
A polymer reinforcing material, consisting of a particulate or filamentary mineral component having a thin polymer-interactive layer, averaging about 5-500 Angstrom in thickness, of silicon-free and heavy metal-free organic molecules chemically bonded to its surface by covalent bonding, when used in relatively small amounts in the range from 1 to 20 phr is capable of providing superior retention or increase of desirable polymer properties especially impact resistance, compared to the use of conventional reinforcement in the same polymer, while providing increased stiffness and retention of strength at elevated temperatures. The reinforcing material is prepared by contacting a particulate or filamentary mineral component which has reactive sites at its surface with certain organic compounds at reaction conditions at which a covalent chemical bond is established between the mineral surface and the organic compound by reaction of a reactive surface site of the mineral with a site-reactive atom or group of the organic compound.

REFERENCES:
patent: 3839062 (1974-10-01), Mercier et al.
patent: 3893969 (1975-07-01), Newbould et al.
patent: 3897586 (1975-07-01), Coker
patent: 3935339 (1976-01-01), Cooke
patent: 3992558 (1976-11-01), Smith-Johannsen et al.
patent: 4017452 (1977-04-01), Swartz
patent: 4091164 (1978-05-01), Schwartz
patent: 4251432 (1981-02-01), Martin
Derwent Abstract 36653 B/19 (Su-612937) Jun. 1978.

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