Thin laminate removal process tooling and method

Details Thin laminate removal process tooling and method Thin laminate removal process tooling and method

1996-11-25

1998-04-28

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 2940203, 294265, B32B 3500

Patent

active

057439907

ABSTRACT:
Laminate or DECAL removal tooling and method for removing an interconnect substrate, such as a thin DECAL-like structure from a surface of a printed wiring board, heat sink, or other rigid substrate or structure. The tooling may be used to remove a thin laminate, such as a polyimide decal, from pattern metallized and pattern unmetallized polyimide, or ceramic metallized substrates, or thermally conductive heat exchangers. A cylindrical thermode is heated and secured with a layer of adhesive to the thin DECAL-like interconnect structure. The thermode has a non slip drive mechanism attached thereto that is coupled to a drive mechanism. The thermode is moved by the drive mechanism to peel the thin laminate from the rigid substrate without damage. This allows a new DECAL-like structure to be applied to the rigid substrate.

REFERENCES:
patent: 3943023 (1976-03-01), Weingrad
patent: 4640735 (1987-02-01), Murray et al.
patent: 5460683 (1995-10-01), Beasley, Jr. et al.

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