Thin laminate as embedded capacitance material in printed...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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C428S623000, C428S626000, C428S416000, C428S425800, C428S458000, C428S460000, C428S461000

Reexamination Certificate

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07413815

ABSTRACT:
The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance.

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patent: 2001/0005304 (2001-06-01), Appelt et al.

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