Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-10-31
1993-05-04
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 67, 439 77, 439591, H01R 909
Patent
active
052075850
ABSTRACT:
A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion thereon for penetrating the surface of the pad or bump to create sidewalls to provide a clean contact surface and the electrode has a recessed surface to limit the penetration of the raised portion. The electrodes may be affixed to a thin flexible membrane to permit each contact to have independent movement over a limited distance and of a limited rotation. The invention overcomes the problem of making easily breakable electrical interconnections to high density arrays of pads or bumps on integrated circuit structures for testing, burn-in or package interconnect and testing applications.
REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 3429040 (1969-02-01), Miller
patent: 3541222 (1970-11-01), Parks et al.
patent: 3634807 (1972-01-01), Grobe et al.
patent: 3654585 (1972-04-01), Wickersham
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3806801 (1974-04-01), Bove
patent: 3862790 (1975-01-01), Davies et al.
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4027935 (1977-06-01), Byrnes et al.
patent: 4038599 (1977-07-01), Bove et al.
patent: 4184729 (1980-01-01), Parks et al.
patent: 4581679 (1986-04-01), Smolley
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4793814 (1988-12-01), Zifcak
patent: 4837507 (1989-06-01), Hechtman
patent: 4991290 (1991-02-01), MacKay
patent: 5020219 (1991-06-01), Leedy
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5069628 (1991-12-01), Crumly
patent: 5133119 (1992-07-01), Afshari et al.
Test Probes Short Form Catalog, Ostby-Barton Test Probes, 1988 Catalog.
ISOCON/TM Interconnections, Printed by Rogers Corporation, 1989.
Byrnes Herbert P.
Halbout Jean-Marc
Scheuermann Michael R.
Shapiro Eugene
Bradley Paula A.
International Business Machines - Corporation
Trepp Robert M.
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