Thin film vertical resistor devices for a thermal ink jet printh

Details Thin film vertical resistor devices for a thermal ink jet printh Thin film vertical resistor devices for a thermal ink jet printh

1986-12-12

1987-09-22

Hartary, Joseph W.

Recorders

Markers and/or driving means therefor

With ink supply to marker

29611, 29846, 219216, 346 11, G01D 1516

Patent

active

046958533

ABSTRACT:
The specification describes thermal ink jet (TIJ) processes and device structures produced thereby wherein either heater resistors or heater resistor-diode combinations are constructed vertically upward from a common supporting substrate. A lower or first metal level conductor pattern provides one part of an X-Y matrix multiplex connection to the resistor/diode components, and a second, upper metal level conductor pattern forms the second part of the X-Y matrix multiplex connection. In this manner, the multiplex drive circuitry for the TIJ printhead resistors/diodes may be fabricated (integrated) directly on the thin film resistor (TFR) printhead substrate. Additionally, the second level metal conductors which overlie the resistive heater and diode elements also serve as a barrier shield to ink corrosion and cavitation wear.

REFERENCES:
patent: 4076575 (1978-02-01), Chang
patent: 4251824 (1981-02-01), Hara
patent: 4429321 (1984-01-01), Matsumoto
patent: 4616408 (1986-10-01), Lloyd

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