Thin film transistors having anodized metal film between the...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S632000, C257S296000

Reexamination Certificate

active

06979840

ABSTRACT:
A thin-film semiconductor device or integrated circuit comprising an insulating substrate, TFTs (thin-film transistors) formed on the substrate, and multilayer conductive interconnections. The circuit has a first metallization layer becoming gate electrodes and gate interconnections. The surface of the first metallization layer is oxidized by anodic oxidation to form an insulating coating on the surface of the first metallization layer. A second metallization layer becoming source and drain electrodes or conductive interconnections is then formed on the insulating coating directly or via an interlayer insulator. An improvement in the production yield and improved reliability are accomplished.

REFERENCES:
patent: 3275915 (1966-09-01), Hariatma
patent: 3878549 (1975-04-01), Yamazaki et al.
patent: 4167018 (1979-09-01), Ohba et al.
patent: 4217374 (1980-08-01), Ovshinsky et al.
patent: 4288256 (1981-09-01), Ning et al.
patent: 4335161 (1982-06-01), Luo
patent: 4345248 (1982-08-01), Togashi et al.
patent: 4379020 (1983-04-01), Glaeser et al.
patent: 4400256 (1983-08-01), Riley
patent: 4438723 (1984-03-01), Cannella et al.
patent: 4445134 (1984-04-01), Miller
patent: 4468853 (1984-09-01), Morita et al.
patent: 4468855 (1984-09-01), Sasaki
patent: 4470852 (1984-09-01), Ellsworth
patent: 4508609 (1985-04-01), Moustakas et al.
patent: 4528082 (1985-07-01), Moustakas et al.
patent: 4619034 (1986-10-01), Janning
patent: 4692994 (1987-09-01), Moniwa et al.
patent: 4727044 (1988-02-01), Yamazaki
patent: 4731642 (1988-03-01), Katto et al.
patent: 4732659 (1988-03-01), Schachter et al.
patent: 4761058 (1988-08-01), Okubo et al.
patent: 4769338 (1988-09-01), Ovshinsky et al.
patent: 4772927 (1988-09-01), Saito et al.
patent: 4777150 (1988-10-01), Deneuville et al.
patent: 4800174 (1989-01-01), Ishihara et al.
patent: 4808553 (1989-02-01), Yamazaki
patent: 4808554 (1989-02-01), Yamazaki
patent: 4814292 (1989-03-01), Sasaki et al.
patent: 4851363 (1989-07-01), Troxell et al.
patent: 4889583 (1989-12-01), Chen et al.
patent: 4900646 (1990-02-01), Senske et al.
patent: 4940523 (1990-07-01), Takeshima
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4954855 (1990-09-01), Mimura et al.
patent: 4988642 (1991-01-01), Yamazaki
patent: 5034340 (1991-07-01), Tanaka et al.
patent: 5047360 (1991-09-01), Nicholas
patent: 5049523 (1991-09-01), Coleman
patent: 5068699 (1991-11-01), Chang
patent: 5112764 (1992-05-01), Mitra et al.
patent: 5124823 (1992-06-01), Kawasaki et al.
patent: 5131075 (1992-07-01), Wilkes et al.
patent: 5132754 (1992-07-01), Serikawa et al.
patent: 5132821 (1992-07-01), Nicholas
patent: 5141885 (1992-08-01), Yoshida et al.
patent: 5146301 (1992-09-01), Yamamura et al.
patent: 5166085 (1992-11-01), Wakai et al.
patent: 5166816 (1992-11-01), Kaneko et al.
patent: 5210050 (1993-05-01), Yamazaki et al.
patent: 5248630 (1993-09-01), Serikawa et al.
patent: 5278093 (1994-01-01), Yonehara
patent: 5283566 (1994-02-01), Mimura et al.
patent: 5289030 (1994-02-01), Yamazaki et al.
patent: 5306651 (1994-04-01), Masumo et al.
patent: 5308998 (1994-05-01), Yamazaki et al.
patent: 5315132 (1994-05-01), Yamazaki
patent: 5359206 (1994-10-01), Yamamoto et al.
patent: 5420048 (1995-05-01), Kondo
patent: 5459090 (1995-10-01), Yamazaki et al.
patent: 5514879 (1996-05-01), Yamazaki
patent: 5521107 (1996-05-01), Yamazaki et al.
patent: 5523240 (1996-06-01), Zhang et al.
patent: 5543636 (1996-08-01), Yamazaki
patent: 5545571 (1996-08-01), Yamazaki et al.
patent: 5561075 (1996-10-01), Nakazawa
patent: 5568288 (1996-10-01), Yamazaki et al.
patent: 5572047 (1996-11-01), Hiroki et al.
patent: 5583366 (1996-12-01), Nakazawa
patent: 5592008 (1997-01-01), Yamazaki et al.
patent: 5604137 (1997-02-01), Yamazaki et al.
patent: 5614732 (1997-03-01), Yamazaki
patent: 5753542 (1998-05-01), Yamazaki et al.
patent: 5780313 (1998-07-01), Yamazaki
patent: 5859445 (1999-01-01), Yamazaki
patent: 6011277 (2000-01-01), Yamazaki
patent: 6177302 (2001-01-01), Yamazaki et al.
patent: 6261877 (2001-07-01), Yamazaki et al.
patent: 6566175 (2003-05-01), Yamazaki et al.
patent: 6607947 (2003-08-01), Zhang et al.
patent: 6849872 (2005-02-01), Yamazaki et al.
patent: 0449-404 (1991-01-01), None
patent: 0 459 763 (1991-12-01), None
patent: 0 486 284 (1992-05-01), None
patent: 55-050664 (1980-04-01), None
patent: 56-111258 (1981-09-01), None
patent: 58-23479 (1983-02-01), None
patent: 58-028873 (1983-02-01), None
patent: 58-93092 (1983-06-01), None
patent: 58-118154 (1983-07-01), None
patent: 59-108360 (1984-06-01), None
patent: 60-014474 (1985-01-01), None
patent: 60-138909 (1985-07-01), None
patent: 60-170972 (1985-09-01), None
patent: 60-257172 (1985-12-01), None
patent: 62-5662 (1987-01-01), None
patent: 62-30379 (1987-02-01), None
patent: 62-63475 (1987-03-01), None
patent: 62-95860 (1987-05-01), None
patent: 62-104171 (1987-05-01), None
patent: 62-104172 (1987-05-01), None
patent: 62-105474 (1987-05-01), None
patent: 62-261128 (1987-11-01), None
patent: 63-76474 (1988-04-01), None
patent: 63076474 (1988-04-01), None
patent: 63-156325 (1988-06-01), None
patent: 63-168052 (1988-07-01), None
patent: 63-261875 (1988-10-01), None
patent: 63261875 (1988-10-01), None
patent: 64-30272 (1989-02-01), None
patent: 64-31967 (1989-02-01), None
patent: 64-35959 (1989-02-01), None
patent: 64-035961 (1989-02-01), None
patent: 01030272 (1989-02-01), None
patent: 64-89464 (1989-04-01), None
patent: 01-129234 (1989-05-01), None
patent: 01-179365 (1989-07-01), None
patent: 1-183853 (1989-07-01), None
patent: 01-184928 (1989-07-01), None
patent: 01222468 (1989-09-01), None
patent: 01-255831 (1989-10-01), None
patent: 1-274116 (1989-11-01), None
patent: 01-274116 (1989-11-01), None
patent: 89-12909 (1989-12-01), None
patent: 2-102573 (1990-04-01), None
patent: 02102573 (1990-04-01), None
patent: 02-130932 (1990-05-01), None
patent: 2-177443 (1990-07-01), None
patent: 2-222547 (1990-09-01), None
patent: 02-239615 (1990-09-01), None
patent: 02238666 (1990-09-01), None
patent: 02260540 (1990-10-01), None
patent: 03-093236 (1991-04-01), None
patent: 03-095938 (1991-04-01), None
patent: 03-095939 (1991-04-01), None
patent: 03-165575 (1991-07-01), None
patent: 03-203322 (1991-09-01), None
patent: 03-280018 (1991-12-01), None
patent: 0 485 233 (1992-05-01), None
patent: 04-177735 (1992-06-01), None
patent: 04-181780 (1992-06-01), None
patent: 04-190329 (1992-07-01), None
patent: 04-196171 (1992-07-01), None
patent: 04-360580 (1992-12-01), None
Proceedings of the SID, vol. 30, No. 2, 1989, pp. 137-141, Tadashi Serikawa et al. Low-Temperature Fabrication of High-Mobility Poly-Si TFT's for Large-Area LCD's.
IEEE Transactions on Electronic Devices, vol. ED-34, No. 10, Oct. 1987, pp. 2124-2128, Shiro Suyama et al. “Electrical Characteristics of MOSFET's Utilizing Oxygen-Argon Sputter-deposited Gate Oxide Films.”
Kunio Masumo, “Low Temperature Polysilicon TFTs by Non-Mass-Separated Ion Flux Doping Technique,” Extended Abstracts of the 22nd (1990 International) Conferences on Solid State Device and Materials, Sendai, 1990, pp. 975-978.
Thin Solid Films, vol. 175, No. 1, Aug. 1989, Luasanne CH, pp. 37-42, A. Kolodziej et al. “Characteristics of Hydrogenated Amorphous Silicon Thin Film Transistors, Fabricated by D.C. Magnetron Sputtering”.
Thomas et al., “CW Laser Annealing of Hydrogenated Amorphous Silicon Obtained by RF Sputtering”, Journal of Applied Physics, 52(1), pp. 476-479.
Wolf et al., “Silicon Processing for the VLSI Era vol. 1: Process Technology”, pp. 516-520, Lattice Press.
Patent Abstracts of Japan, vol. 10, No. 125 (E-402) May 10, 1986 & JP-A-60 257 172 (Nippon Denshi Denwa Kosha) Dec. 18, 1985.
Patent Abstracts of Japan, vol. 8, No. 4, (E-220) Jan. 10, 1984 & JP-A-58 170 064 (Tokyo Shibaura Denki K.K.) Oct. 6, 1983.
Patent Abstracts of Japan, vol. 9, No. 189, (E-333) Aug. 6, 1985 & JP-A-60 057 975 (Matsushita Denski Sangyo K.K.) Apr. 3, 1985.
Patent Abstracts of Japan, vol. 13, No. 220, (E-762) May 23, 1989 & JP-A-01 031 466 (N.T.T. Corp.) Feb. 1, 1989.
Patent Ab

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film transistors having anodized metal film between the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film transistors having anodized metal film between the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film transistors having anodized metal film between the... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3487618

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.