Thin film transistor with improved junction region

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Reexamination Certificate

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C257SE29151

Reexamination Certificate

active

07825411

ABSTRACT:
A thin film transistor and method of fabricating the same are provided. In the thin film transistor, a seed or a grain boundary exists in a semiconductor layer pattern but not in a junction region. The method includes forming a semiconductor layer pattern. Forming the semiconductor layer pattern includes: forming and patterning a first capping layer on an amorphous silicon layer; forming a second capping layer on the first capping layer pattern; forming a metal catalyst layer on the second capping layer; diffusing the metal catalyst; and crystallizing the amorphous silicon layer to form a polysilicon layer. Therefore, it is possible to prevent that a trap is generated in the junction region, thereby obtaining improved and uniform characteristics of the device.

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Notice of Allowance dated Dec. 31, 2008 (from copending U.S. Appl. No. 11/279,798).
Office Action dated Aug. 4, 2008 (from copending U.S. Appl. No. 11/279,798).
Japanese Office Action dated Jul. 29, 2008.

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