Thin film transistor substrate for display device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

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Details

C257S059000, C257S071000, C257SE29273, C438S149000, C438S155000, C349S043000, C435S092000

Reexamination Certificate

active

10963599

ABSTRACT:
A thin film transistor (TFT) substrate is fabricated in three mask processes. In a first mask process, a gate line and a gate electrode are formed. In a second mask process, a data line, a source electrode, a drain electrode, a semiconductor layer, and a first upper storage electrode overlapping the gate line are formed from a gate insulating film, undoped and doped amorphous silicon layers, and a data metal layer. In a third mask process, a pixel hole is formed through protective and gate insulating films within and outside a pixel area, the first upper storage electrode is partially removed, a pixel electrode contacts a side of the drain electrode within the pixel hole at the pixel area, and a second upper storage electrode contacts a side of the first upper storage electrode in the pixel hole outside the pixel area.

REFERENCES:
patent: 2002/0008798 (2002-01-01), Song et al.
patent: 2003/0197182 (2003-10-01), Kim et al.
patent: 2004/0263722 (2004-12-01), Oh et al.
patent: 2005/0077522 (2005-04-01), Chang et al.

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