Thin film transistor, method of fabricating the thin film...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

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C257S059000, C257S258000, C257SE21413

Reexamination Certificate

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07838885

ABSTRACT:
A thin film transistor (TFT), a method of fabricating the TFT, and a display device including the TFT are provided. The TFT includes a semiconductor layer having a channel region and source and drain regions is crystallized using a crystallization-inducing metal. The crystallization-inducing metal is gettered by either a metal other than the crystallization-inducing metal or a metal silicide of a metal other than the crystallization-inducing metal. A length and width of the channel region of the semiconductor layer and a leakage current of the semiconductor layer satisfy the following equation: Ioff/W=3.4E-15L2+2.4E-12L+c, wherein Ioff (A) is the leakage current of the semiconductor layer, W (mm) is the width of the channel region, L (μm) is the length of the channel region, and “c” is a constant ranging from 2.5E-13 to 6.8E-13.

REFERENCES:
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patent: 7045444 (2006-05-01), Yamazaki et al.
patent: 2002/0074548 (2002-06-01), Lee et al.
patent: 2003/0122129 (2003-07-01), Yamazaki et al.
patent: 2007/0284627 (2007-12-01), Kimura
patent: 1437761 (2003-08-01), None
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patent: 2003-69852 (2003-08-01), None
patent: 2003-73076 (2003-09-01), None
patent: 2004-41074 (2004-05-01), None
patent: 2006-99694 (2006-09-01), None
Korean Notice of Allowability for KR 2007-57900 issued on May 19, 2008.

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