Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-04-03
2008-11-25
Lindsay, Jr., Walter (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S142000, C257SE27100, C257SE29117
Reexamination Certificate
active
07456038
ABSTRACT:
A method of producing a thin film transistor comprises irradiating a resist on a glass base plate with a ray from a light source through a mask and, thereafter, developing the resist to form contact holes, using an i-ray as the ray.
REFERENCES:
patent: 5691115 (1997-11-01), Okamoto et al.
patent: 2004/0234900 (2004-11-01), Schroeder
patent: 2006/0170836 (2006-08-01), Kondo et al.
patent: 1567068 (2008-08-01), None
patent: 2003-234285 (2003-08-01), None
“Ultrafine Machining Technique” issued Feb. 25, 1997, by Ohmsha.
Machine translation (furnished by the Chinese Patent Office website) of Reference BB.
Jul. 11, 2008 Office action issued against Chinese Patent Application No. 200610071921.2 which corresponds to U.S. Appl. No. 11/397,925.
Matsumura Masakiyo
Taniguchi Yukio
Yamaguchi Hirotaka
Kabushiki Kaisha Ekisho Sentan Gijutsu Kaihatsu Center
Lindsay, Jr. Walter
Mustapha Abdulfattah
Stoel Rives LLP
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