Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only
Reexamination Certificate
2007-01-30
2007-01-30
Ngo, Huyen (Department: 2871)
Liquid crystal cells, elements and systems
Particular structure
Having significant detail of cell structure only
C349S039000, C349S038000
Reexamination Certificate
active
10867809
ABSTRACT:
A thin film transistor array substrate having spacers formed without sacrificing an aperture ratio and a method for fabricating the same. The thin film transistor array substrate according to the present invention includes a gate line on a substrate; a gate insulating film on the gate line; a data line on the gate insulating film, the data line crossing the gate line to define a pixel region and the gate insulating film between the gate line and the data line, wherein at least one of the gate line and the data line includes a protrusion; a thin film transistor at a crossing the gate line and the data line; a pixel electrode at the pixel region, the pixel electrode connected to the thin film transistor; and a spacer within the protrusion dispensed by an ink-jet system.
REFERENCES:
patent: 5748266 (1998-05-01), Kodate
patent: 6088071 (2000-07-01), Yamamoto et al.
patent: 6245469 (2001-06-01), Shiba et al.
patent: 6501527 (2002-12-01), Hirose et al.
patent: 10-048636 (1998-02-01), None
patent: 10-339885 (1998-12-01), None
patent: 11212075 (1999-08-01), None
patent: 2000122072 (2000-04-01), None
patent: 2002182236 (2002-06-01), None
Jun Jae Hong
Lee Yun Bok
LG.Philips LCD Co. , Ltd.
McKenna Long and Aldridge LLP
Ngo Huyen
Qi Mike
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