Thin film transistor array panel

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Reexamination Certificate

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C257S072000, C257S347000

Reexamination Certificate

active

06911669

ABSTRACT:
A method of forming a thin film transistor array panel is described. The thin film transistor array comprises a substrate, a plurality of scan lines, a plurality of gates a plurality of first bonding pads and a plurality of second bonding pads, wherein the first bonding pads are connected with the scan lines. The first bonding pads and the second bonding pads are formed as a part of the first metal layer. The data lines are extended to electrically connected with the second bonding pads via contact windows.

REFERENCES:
patent: 6204081 (2001-03-01), Kim et al.
patent: 6590226 (2003-07-01), Kong et al.
patent: 6656776 (2003-12-01), Kim et al.

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