Thin-film transistor and method for the manufacture thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

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257302, 257401, 437225, H01L 2976, H01L 21302

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active

055280536

ABSTRACT:
A thin-film transistor has a doped polysilicon layer arranged at the surface of a substrate and has a polysilicon structure arranged on the doped polysilicon layer that is doped with the opposite conductivity type and that is limited by a sidewall is provided. The polysilicon structure has a source/drain region that is doped with the conductivity type of the doped polysilicon layer. A gate dielectric and a gate electrode thereon are arranged on the sidewall of the polysilicon structure between source/drain region and polysilicon layer, which likewise acts as source/drain region.

REFERENCES:
patent: 4630088 (1986-12-01), Ogura et al.
patent: 5064775 (1991-11-01), Chang
patent: 5136350 (1992-08-01), Itoh
"Impact of Surrounding Gate Transistor (SGT) for Ultra-High Density LSI's", by Hiroshi Takato, et al, et al., IEEE Transactions on Electron Devices, vol. 38, No. 3, Mar. 1991, pp. 573-578.
"Mechanism of Plasma Hydrogenation of Polysilicon Thin Film Transistors", by Uday Mitra et al, J. Electrochem. Soc. vol. 138, No. 11, Nov. 1991, pp. 3420-3424.
"The Effect of Interface States on Amorphous-Silicon Transistors", by Nobuki Ibaraki, et al., IEEE Transactions on Electron Devices, vol. 36, No. 12, Dec. 1989, pp. 2971-2972.
"Subscriber Line Interface Circuit LSI Fabricated Using High-Voltage CMOS/SIMOX Technology", Electronics Letters, 8th Dec. 1983, vol. No. 25/26, pp. 1095-1097.
"A Half Micron SRAM Cell Using a Double-Gated Self-Aligned Polysilicon PMOS Thin Film Transistor (TFT) Load", by A. O. Adan, etal. Integrated Cir.Group.Corp. 1990 Sym on VLSI Tech. pp. 19-20.

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