Thin film tape head assembly

Details Thin film tape head assembly Thin film tape head assembly

1991-05-28

1993-08-17

Hannaher, Constantine

Dynamic magnetic information storage or retrieval

Head

Core

360121, 360122, 360125, G11B 529, G11B 531, G11B 5187

Patent

active

052374769

ABSTRACT:
A thin film tape head assembly is formed by depositing a multiplicity of thin film transducers on a ceramic wafer or substrate. The wafer is divided into head bars, each of which has one or more thin film transducers on its face. End sections and a cover bar are joined to the head bar to form a head bar subassembly. A flexible cable or electrical pins are provided between the end sections to enable electrical connection between the head circuit and external circuitry. By joining a number of head bar subassemblies, a multigap thin film tape head assembly is produced to serve as a read/write device.

REFERENCES:
patent: 4967300 (1990-10-01), Reid et al.
patent: 4991046 (1991-02-01), Adamson et al.
J. E. Schaps, "Magnetic Head." IBM Technical Disclosure Bulletin, vol. 13, No. 8 (Jan. 1971) p. 2362.

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