Thin-film structure method of fabrication

Details Thin-film structure method of fabrication Thin-film structure method of fabrication

1994-11-08

1995-08-22

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Mold, mask, or masterform

205 75, 430 18, C25D 110

Patent

active

054437130

ABSTRACT:
A process for fabricating a thin-film structure using a transparent substrate is disclosed. A first structure, such as a ring, is formed of a dielectric material on a conductive material layer. The conductive material is partially removed, such as within the center of the ring structure. A photoresist material pillar is formed to fill the center of the ring structure, protruding above the ring structure rim. Such structures are useful as mandrel structures in the forming of precision components, such as nozzle plates, mesh ink filter screens, and the like, for ink-jet pens.

REFERENCES:
patent: 4229265 (1980-10-01), Kenworthy
patent: 4773971 (1988-09-01), Lam et al.
patent: 4839001 (1989-06-01), Bakewell
patent: 4954225 (1990-09-01), Bakewell
patent: 5255017 (1993-10-01), Lam

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