Thin film semiconductor element and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – Having specific type of active device

Reexamination Certificate

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Details

C257S223000, C257S227000, C257S291000, C257S412000

Reexamination Certificate

active

07105872

ABSTRACT:
The invention provides a thin film semiconductor element and a method of manufacturing the same to achieve lowering the resistance of gate electrodes, lowering the capacitance of source electrodes, and enhancing etching characteristics. The thin film semiconductor element can include a semiconductor film provided on a substrate, source and drain electrodes connected to the semiconductor film, and a gate electrode provided on the semiconductor film with an insulating film interposed therebetween. The film thickness of the source and drain electrodes can be smaller than the film thickness of the gate electrode.

REFERENCES:
patent: 5851860 (1998-12-01), Makita et al.
patent: 6166396 (2000-12-01), Yamazaki
patent: 6495857 (2002-12-01), Yamazaki
patent: A 10-20345 (1998-01-01), None
patent: A 2000-81632 (2000-03-01), None
patent: A 2001-28439 (2001-01-01), None
patent: A 2001-102445 (2001-04-01), None
patent: 10-0260975 (1996-02-01), None
patent: 10-0401654 (1997-02-01), None

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