Semiconductor device manufacturing: process – Chemical etching
Patent
1997-10-15
1999-08-03
Beck, Shrive
Semiconductor device manufacturing: process
Chemical etching
438125, 438149, 438311, 438496, 438669, 438778, 438795, 438902, H01L 21331, H01L 2100
Patent
active
059324848
ABSTRACT:
A thin film semiconductor device comprising a thin film transistor (TFT) having a thin film semiconductor on an insulation substrate to define an element region, and a hygroscopic interlayer dielectric which covers the element. A hydrogenation treatment which comprises the interlayer dielectric provided thereon a cap film for blocking hydrogen diffusion, so that water entrapped by the interlayer dielectric may be decomposed to generate hydrogen which is allowed to diffuse into the thin film transistor provided on the side opposite to that of the cap film.
REFERENCES:
patent: 4906587 (1990-03-01), Blake
patent: 4943837 (1990-07-01), Konishi et al.
patent: 5656825 (1997-08-01), Kusumoto et al.
patent: 5712946 (1998-01-01), Takahashi et al.
Ikeda Hiroyuki
Ino Masumitsu
Iwanaga Toshihiko
Kaise Kikuo
Urazono Takenobu
Barr Michael
Beck Shrive
Sony Corporation
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