Thin film seeds for melt processing textured superconductors for

Superconductor technology: apparatus – material – process – High temperature devices – systems – apparatus – com- ponents,... – Superconductor next to superconductor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

505126, 505450, 505451, 505733, 505780, 427 62, H01L 3900

Patent

active

058694315

ABSTRACT:
A method of fabricating bulk superconducting material such as RBa.sub.2 Cu.sub.3 O.sub.7-.delta. where R is La or Y comprising depositing a thin epitaxially oriented film of Nd or Sm (123) on an oxide substrate. The powder oxides of RBa.sub.2 Cu.sub.3 O.sub.7-.delta. or oxides and/or carbonates of R and Ba and Cu present in mole ratios to form RBa.sub.2 Cu.sub.3 O.sub.7-.delta., where R is Y or La are heated, in physical contact with the thin film of Nd or Sm (123) on the oxide substrate to a temperature sufficient to form a liquid phase in the oxide or carbonate mixture while maintaining the thin film solid to grow a large single domain 123 superconducting material. Then the material is cooled. The thin film is between 200 .ANG. and 2000 .ANG.. A construction prepared by the method is also disclosed.

REFERENCES:
patent: 5308799 (1994-05-01), Morita et al.
Todt, Journal of Electronic Materials, vol. 23, No. 11, 1994, pp. 1127-1130.
Badaye et al, Appl. Phys. Lett. 66(16) Apr. 1995, pp. 2131-2133.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film seeds for melt processing textured superconductors for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film seeds for melt processing textured superconductors for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film seeds for melt processing textured superconductors for will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1948401

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.