Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Including passive device
Reexamination Certificate
2005-09-29
2008-08-26
Pham, Thanhha (Department: 2813)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Including passive device
C438S384000, C257SE21004
Reexamination Certificate
active
07416951
ABSTRACT:
An integrated circuit includes a first thin film resistor on a first dielectric layer. A first layer of interconnect conductors on the first dielectric layer includes a first and second interconnect conductors electrically contacting the first thin film resistor. A second dielectric layer is formed on the first dielectric layer. A second thin film resistor is formed on the second dielectric layer. A third dielectric layer is formed on the second dielectric layer. A second layer of interconnect conductors on the third dielectric layer includes a third interconnect conductor extending through an opening in the second and third dielectric layers to contact the first interconnect conductor, a fourth interconnect conductor extending through an opening in the second and third dielectric layers to contact the second interconnect conductor, and two interconnect conductors extending through openings in the third dielectric layer of the second thin film resistor. A fifth interconnect conductor extends through an opening in the first dielectric layer to contact a circuit element.
REFERENCES:
patent: 4019168 (1977-04-01), Collins
patent: 6703666 (2004-03-01), Huttemann et al.
patent: 7217981 (2007-05-01), Coolbaugh et al.
Beach Eric W.
Drobny Vladimir F.
Robinson Derek W.
Brady III W. James
Pham Thanhha
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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