Thin film reinforcing structure and method for manufacturing the

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

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428131, 428134, 428195, 428332, 428337, 4284735, 430 11, 430 18, 430322, 430325, 378161, B32B 310

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055783600

ABSTRACT:
The invention relates to a reinforcing structure for a thin film, particularly for an ultrathin film permeable to X-ray and ultraviolet radiation, and a method for manufacturing a reinforcing structure for a thin film with a thickness less than 5 micrometers. According to the invention, on the surface of the thin film, there is formed, in a bakeing treatment of at least one step, a reinforcing structure made of some photosensitive material such as polymer.

REFERENCES:
patent: 4079159 (1978-03-01), Sano et al.
patent: 4253029 (1981-02-01), Lepselter et al.
patent: 4254174 (1981-03-01), Flanders et al.
patent: 4426247 (1984-01-01), Tamamura et al.
patent: 4522842 (1985-06-01), Levinstein et al.
patent: 4677042 (1987-06-01), Kato et al.
patent: 4770974 (1988-09-01), Hiraoka
patent: 4808682 (1989-02-01), Schwalm et al.
patent: 4939052 (1990-07-01), Nakagawa
patent: 4999280 (1991-03-01), Hiraoka
patent: 5039203 (1991-08-01), Nishikawa
patent: 5145940 (1992-09-01), Wernet et al.
patent: 5258091 (1993-11-01), Imai et al.
patent: 5300403 (1994-04-01), Angelopolus et al.

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