Thin film process monitoring techniques using acoustic waves

Details Thin film process monitoring techniques using acoustic waves Thin film process monitoring techniques using acoustic waves

1991-08-14

1993-12-21

Williams, Hezron E.

Measuring and testing

Vibration

By mechanical waves

73627, 73629, 73643, 73655, 73657, G01N 2910, G01N 2924

Patent

active

052712745

ABSTRACT:
A system and method is disclosed for measuring thickness of at least one film on a substrate by propagating an acoustic wave through the film on a substrate such that echo waves are generated and received by a transducer. An output signal is generated and processed to give a thickness value. The thickness valve is obtained from the time lapse between the propagated wave and receipt of the echo wave; by the frequency domain of the echo wave; or the phase of the echo wave.

REFERENCES:
patent: 4253326 (1981-03-01), Munnich et al.
patent: 4334433 (1982-06-01), Takahashi et al.
patent: 5009103 (1991-04-01), Sato et al.
patent: 5038615 (1991-08-01), Trulson et al.

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