Thin film probe

Details Thin film probe Thin film probe

1995-04-24

1997-05-06

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428622, 428623, 324754, 324755, 324757, H01L 2166, G01R 3126

Patent

active

056269714

ABSTRACT:
The present invention relates to a multichip module comprising one or more thin film probes. The thin film probes are useful in in situ probe testing of IC chips. An assembly comprising the multichip module and a circuit board having IC chips in a number corresponding to the number of thin film probes is also claimed.

REFERENCES:
patent: 3382632 (1968-05-01), Ardezzone
patent: 4963225 (1990-10-01), Lehman-Lamer
patent: 5091769 (1992-02-01), Eichelberger
patent: 5123850 (1992-06-01), Elder et al.
patent: 5262718 (1993-11-01), Svendsen et al.
patent: 5374893 (1994-12-01), Koopman et al.
patent: 5406210 (1995-04-01), Pedder
patent: 5440239 (1995-08-01), Zappella et al.

Affiliated with

Also associated with

Rating

Thin film probe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film probe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film probe will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2131192