Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1998-12-15
2000-11-28
Gulakowski, Randy
Etching a substrate: processes
Forming or treating thermal ink jet article
216 16, 347 62, B41J 204, G11B 5127
Patent
active
061531146
ABSTRACT:
The present invention provides an ink-jet printhead substructure highly thermally efficient and greatly simplified in both the method of manufacture and resulting structure. The printhead substructure of the present invention comprises a resistor formed on an insulated substrate, a single conductor layer that provides both the conductive bonding interconnect pads and the conductive traces for the substructure, a passivation layer and a cavitation barrier. The resistor, passivation layer and cavitation barrier may comprise a single graded layer. The graded thin-film structure provides the resistor, passivation and cavitation barrier components without creating abrupt layer interfaces thereby, improving printhead reliability and durability. Fabrication of the printhead substructure of the present invention requires only two or three lithographic masks and a minimized number of sputter source materials.
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Buonanno Mark A.
Figueredo Domingo A.
Thomas David R.
Ahmed Shamim
Gulakowski Randy
Hewlett--Packard Company
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