Thin film phosphor sputtering process

Details Thin film phosphor sputtering process Thin film phosphor sputtering process

1982-05-06

1983-06-21

Demers, Arthur P.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204192R, 204298, 2041571R, C23C 1500

Patent

active

043892957

ABSTRACT:
A process and associated system for forming a thin film phosphor layer which is comprised of a host substance doped with an activator and which layer is formed by a sputtering process. Heat is applied to the substrate to elevate the temperature thereof while maintaining a vacuum in the sputtering chamber. The substrate is supported for movement in the chamber. Sputtering is accomplished within the chamber by causing a sputtering gas to flow therein while concurrently exciting host and activator targets to form a plasma in the chamber and maintaining this sputtering for a predetermined period of time.

REFERENCES:
patent: 3515663 (1970-06-01), Bodway
patent: 3775285 (1973-11-01), Lane
patent: 3787312 (1974-01-01), Wagner et al.
patent: 3793167 (1974-02-01), Glaser
patent: 3884787 (1975-05-01), Kuehnle
patent: 4248687 (1981-02-01), Fan

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