Thin film pattern forming device and method

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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Details

C438S771000, C977S720000, C977S777000, C977S787000, C977S858000

Reexamination Certificate

active

07834332

ABSTRACT:
A thin film pattern forming device includes a chamber case having an inner space communicated with the outside, a first fixing unit provided in the chamber case, a pattern electrode plate having a certain shape and fixed to the first fixing unit, and a second fixing unit provided in the chamber case and spaced apart from the pattern electrode plate. A substrate on which an inked metallic nano-material is deposited is received on the second fixing unit. The device also includes a power supply unit for supplying power to the first fixing unit and the second fixing unit, and a drying unit for drying the inked metallic nano-material patterned on the substrate.

REFERENCES:
patent: 7544938 (2009-06-01), Stewart et al.
patent: 2002/0039166 (2002-04-01), Song
patent: 2004/0033679 (2004-02-01), Jacobson et al.
patent: 2004/0160505 (2004-08-01), Ando
patent: 2005/0176849 (2005-08-01), Yang
patent: 2006/0145146 (2006-07-01), Suh et al.
patent: 2006/0164813 (2006-07-01), Yoshioka et al.
patent: 2006/0279843 (2006-12-01), Kurt et al.
patent: 2008/0041814 (2008-02-01), Romano et al.
patent: 2008/0286521 (2008-11-01), Eberlein et al.
patent: 1511086 (2004-07-01), None
patent: 1660597 (2005-08-01), None
Chinese Office Action date Jan. 4, 2008.

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