Thin film multi-layer wiring substrate having a coaxial...

Details Thin film multi-layer wiring substrate having a coaxial... Thin film multi-layer wiring substrate having a coaxial...

2005-09-13

2005-09-13

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S760000, C257S774000, C257S775000, C257S776000, C428S209000, C428S210000, C156S233000, C156S234000, C156S235000

Reexamination Certificate

active

06943447

ABSTRACT:
A thin film multi-layer wiring substrate comprising a plurality of wiring layers, each adjacent pair of wiring layers being separated by an insulating layer, wherein at least one of the wiring layers includes wiring formed by an inner conductor member and a conductor layer surrounding the periphery thereof through an insulating material.

REFERENCES:
patent: 5439732 (1995-08-01), Nagasaka et al.
patent: 6143116 (2000-11-01), Hayashi et al.
patent: 2002/0182958 (2002-12-01), Tani et al.
patent: 08-181485 (1996-07-01), None
patent: 11-154675 (1999-06-01), None

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