Thin-film multi-layer substrate and electronic device

Details Thin-film multi-layer substrate and electronic device Thin-film multi-layer substrate and electronic device

1997-10-10

2000-04-25

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174267, 174260, 361773, 361774, H01R 1204, H01R 1232

Patent

active

060546522

ABSTRACT:
The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.

REFERENCES:
patent: 5421083 (1995-06-01), Suppelsa et al.
patent: 5432675 (1995-07-01), Sorimachi et al.
patent: 5543586 (1996-08-01), Crane, Jr. et al.
patent: 5834705 (1998-11-01), Jonaidi

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