Thin film microstrip circuits

Electrical resistors – With base extending along resistance element – Resistance element coated on base

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29620, 156656, 219543, 338327, 338328, 351 71, 427 89, 428607, H01C 1012

Patent

active

043969003

ABSTRACT:
A four layer thin film metallization system is comprised of layers of tantalum, chromium, copper and gold and is useful in high resolution, low loss microstrip circuits. The metallization system is compatible with lead-tin solder and, in addition, provides low insertion losses at X-band frequencies.

REFERENCES:
patent: 3296574 (1967-01-01), Tassara
patent: 3381256 (1968-04-01), Schuller et al.
patent: 3387952 (1968-06-01), Chapelle
patent: 3423260 (1969-01-01), Heath et al.
patent: 3476531 (1969-11-01), Brewer et al.
patent: 3495959 (1970-02-01), Johnson, Jr.
patent: 3496513 (1970-02-01), Helgeland
patent: 3607476 (1971-09-01), Basseville et al.
patent: 3813519 (1974-05-01), Zochim et al.
patent: 3823348 (1974-07-01), Agusta et al.
patent: 3849757 (1974-11-01), Khammous et al.
patent: 3881884 (1975-05-01), Cook et al.
patent: 4117589 (1978-10-01), Francis et al.
patent: 4164607 (1979-08-01), Thiel et al.
Aland, "Metal Contacts for Carmat Film Resistors", IBM Technical Disclosure ulletin, vol. 9, No. 6, Nov. 1966, p. 581.

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