Thin-film microcircuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

338307, 338308, 428201, 430311, 156630, 156634, 156643, H05K 0114

Patent

active

042270391

ABSTRACT:
Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby removing exposed portions of the thin-film laminate as a result of dispersion and evaporation thereof. Unexposed portions of the thin-film laminate provide a desired pattern. The electrical property-imparting film is a thin-film of noble metal such as gold, silver or platinum or a thin film of transparent electrode material such as SnO.sub.2 or In.sub.2 O.sub.3, which is not easily dispersible upon application of the above energy.

REFERENCES:
patent: 3379568 (1968-04-01), Holmes
patent: 3772631 (1973-11-01), Owen
patent: 3801366 (1974-04-01), Lemelson
patent: 3947801 (1975-01-01), Bube
patent: 3977840 (1976-08-01), Estep
patent: 4000334 (1976-12-01), Hallman
patent: 4082861 (1978-04-01), Izu
patent: 4121007 (1978-10-01), Kobayashi et al.
Miller, L. F., Preventing Corroison of Deleted Printed Circuit Lines, IBM Tech. Disclosure Bull, vol. 17, #2, Jul. 1974, p. 439.
Kremen, S. H., Laser Hole Making in Printed Circuit Boards, IBM Tech. Disclosure Bull., vol. 8, #3, Aug. 1965, p. 434.
Carlson et al., Helium-Neon Laser: Thermal High-Resolution Recording; Science, vol. 154, pp. 1550-1551, Sep. 1966.
Amodei et al., Holograms in Thin Bismuth Films; Applied Physics Letters, Jun. 1969, vol. 15, #2, pp. 45-46.

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