Thin film metal package for LSI chips

Details Thin film metal package for LSI chips Thin film metal package for LSI chips

1979-06-29

1981-10-13

Kucia, Richard R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 361392, 361409, H05K 116

Patent

active

042951836

ABSTRACT:
An integrated circuit board for mounting very high density chips of small size on its top surface including conductor planes for carrying very large values of .DELTA.I (transient current) is constructed with a plurality of essentially flat parallel power planes serving as conductive leads to the chip connectors (pins or solder balls). The land areas on the top surface of the board are connected to conductors below by integrated coaxial conductor extensions from the planes having a high degree of capacitive coupling to adjacent conductor planes.

REFERENCES:
patent: 3217089 (1965-11-01), Beck
patent: 3312870 (1967-04-01), Rhoades
patent: 3398232 (1968-08-01), Hoffman
patent: 3499219 (1970-03-01), Griff
patent: 3519959 (1970-07-01), Bewley
patent: 3530411 (1970-09-01), Sear
patent: 3663866 (1972-05-01), Iosue
patent: 3676748 (1972-07-01), Kobayashi
patent: 3832769 (1974-09-01), Olyphant
patent: 3875478 (1975-04-01), Capstick
patent: 4237522 (1980-12-01), Thompson
Hedeman et al., Wiring Parallator, IBM Tech. Dis. Bull., vol. 13 #12, May 1971, pp. 3623 & 3624 relied on.

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