Dynamic magnetic information storage or retrieval – Head – Core
Reexamination Certificate
2008-05-06
2008-05-06
Heinz, A. J. (Department: 2627)
Dynamic magnetic information storage or retrieval
Head
Core
Reexamination Certificate
active
10953307
ABSTRACT:
A thin film magnetic head having a high write-in accuracy can be produced by suppressing a magnetic field leak between upper and lower magnetic poles. The method of producing the thin film magnetic head, in which a head substrate, magnetoresistance effect element, lower magnetic pole, write gap layer and an upper magnetic pole are formed in this order, has the lower magnetic pole patterned with a larger width than that of the upper magnetic pole in a write magnetic pole after the lower magnetic pole is formed. An insulation layer is formed in the same layer as the lower magnetic pole such that the insulation layer is flattened with the lower magnetic pole. The upper magnetic pole is formed on a surface of the write gap layer after the write gap layer is formed, and a protrusion of the lower magnetic pole is removed from a side face thereof.
REFERENCES:
patent: 5966277 (1999-10-01), Koshikawa et al.
patent: 6477006 (2002-11-01), Sato
patent: 60-035315 (1985-02-01), None
patent: 04-157607 (1992-05-01), None
patent: 06-124415 (1994-05-01), None
patent: 06-349026 (1994-12-01), None
patent: 11-007608 (1999-01-01), None
patent: 11-353618 (1999-12-01), None
patent: 2000215411 (2000-08-01), None
patent: 2001176023 (2001-06-01), None
patent: 2002074611 (2002-03-01), None
Fujita Mutsumi
Ito Takashi
Fujitsu Limited
Greer Burns & Crain Ltd.
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