Thin film magnetic head

Dynamic magnetic information storage or retrieval – Head – Magnetoresistive reproducing head

Reexamination Certificate

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C360S125330

Reexamination Certificate

active

06349021

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Present Invention
The present invention relates to a thin film magnetic head and, more particularly, to a combined-type thin film magnetic head in which a read magnetoresistive (MR) head having a magnetoresistive device and a write inductive head having a coil layer and a core layer are laminated.
2. Description of the Related Art
FIG. 5
is a perspective view of a conventional thin film magnetic head,
FIG. 6
is a sectional view taken along the line
6

6
of
FIG. 5
,
FIG. 7
is an enlarged front view observed from a direction indicated by an arrow
7
in
FIG. 6
, and
FIG. 8
is a schematic top plan view observed from a direction indicated by an arrow
8
in FIG.
6
. Furthermore,
FIG. 9
is a schematic top plan view illustrating a lead-out line pattern of the conventional thin film magnetic head, and
FIG. 10
is a top plan view illustrating an upper shield layer and a coil layer of the conventional thin film magnetic head.
A slider
1
of a thin film magnetic head mounted on a magnetic recording device such as a hard disk drive is composed of a ceramic material, e.g. a combination of alumina (Al
2
O
3
) and titanium carbide (TiC). The slider
1
has a read end surface
1
a
facing toward an upstream side of a moving direction of a disk surface of a magnetic recording medium, a trailing end surface
1
b
facing toward a downstream side, and a rail-shaped ABS surface
1
c
opposing a disk surface of the slider
1
as shown in FIG.
5
. The trailing end surface
1
b
is provided with a head device
2
and four bonding pads
3
for connection with an external circuit.
The head device
2
, which is formed of a thin film, is constituted by a combined-type thin film magnetic head wherein a read magnetoresistive magnetic head (hereinafter referred to as an “MR head”)
2
a
and a write inductive magnetic head (hereinafter referred to as an “inductive head”)
2
b
that is deposited on the MR head
2
a
as shown in FIG.
6
.
Referring to FIG.
6
and
FIG. 7
, the MR head
2
a
has a lower shield layer
2
a
1
formed of a Ni—Fe type alloy or a Permalloy, a lower gap layer
2
a
2
that is formed of a nonmagnetic material such as Al
2
O
3
and deposited on the lower shield layer
2
a
1
, a magnetoresistive (MR) device
2
a
3
provided in a central portion of an upper layer of the lower gap layer
2
a
2
, an electrode layer
2
a
4
formed from an upper surface of both ends of the MR device
2
a
3
through a surface of the lower gap layer
2
a
2
, an upper gap layer
2
a
5
that is provided on the MR device
2
a
3
and an upper layer of the electrode layer
2
a
4
and formed of a nonmagnetic material such as Al
2
O
3
, and an upper shield layer
2
a
6
′ that is formed on the upper layer of the upper gap layer
2
a
5
by plating and is formed of a magnetic material such as a Ni—Fe type alloy or Permalloy, all the layers being deposited on a trailing end surface
1
b
of the slider
1
. The MR device
2
a
3
shown in
FIG. 7
illustrates an anisotropic magnetoresistive (AMR) device that is formed of an SAL film Sa, a SHUNT film Sh, and an MR film M having magnetoresistive effect, the films being laminated in this order from the bottom. Furthermore, the electrode layer
2
a
4
shown in
FIG. 7
is comprised of a lower layer that is a hard bias layer H composed of CoPt, CoCrPt or the like, and an upper layer that is an electroconductive layer C composed of chrome (Cr), copper (Cu), or the like. The hard bias layer H applies a bias magnetic field, which is known as a longitudinal bias, to the MR film M in a direction parallel to the film surface thereof. In the MR head
2
a,
a reading magnetic gap length G
1
is decided by a distance between the MR film M and the lower shield layer
2
a
1
or the upper shield layer
2
a
6
′. A track width Tw is decided by a range wherein sense current flows between the two electrode layers
2
a
4
at both sides in the MR film M. A giant magnetoresistive (GMR) device may be used as the MR device
2
a
3
.
Referring now to FIG.
6
and
FIG. 8
, the inductive head
2
b
includes a lower core layer
2
b
1
′ serving also as the upper shield layer
2
a
6
′ of the MR head
2
a
, a nonmagnetic material layer
2
b
2
that is provided above the lower core layer
2
b
1
′ and forms a write magnetic gap G, a coil insulating layers
2
b
3
and
2
b
3
′ that are deposited on the nonmagnetic material layer
2
b
2
and composed of an organic resin material or the like, flat spiral coil layers
2
b
4
that are buried in the coil insulating layers
2
b
3
and
2
b
3
′ and composed of a low-resistance electroconductive material such as Cu, and an upper core layer
2
b
5
that has one end thereof in contact with the nonmagnetic material layer
2
b
2
adjacent to the ABS surface
1
c
and the other end thereof connected to the lower core layer
2
b
1
′, and is composed of a magnetic material such as a Ni—Fe, type alloy or Permalloy.
Referring now to FIG.
8
and
FIG. 9
, two connecting terminals
10
a
and
10
b
that are formed simultaneously and located away from the lower core layer
2
b
1
′ are formed at both sides of the lower core layer
2
b
1
′ and connected to the two electrode layers
2
a
4
that are connected to both ends of the MR device
2
a
3
. Furthermore, four lead-out lines
4
a,
4
b,
4
c,
and
4
d
formed of a low-resistance electroconductive material such as copper (Cu) are provided on the coil insulating layer
2
b
3
by being plated thereon at the same time when the coil layers
2
b
4
are formed. Two lead-out lines
4
a
and
4
b
respectively have connection ends
4
a
1
and
4
b
1
that oppose both sides of the lower core layer
2
b
1
′ and are conductively connected to the two connecting terminals
10
a
and
10
b,
respectively, via contact holes (not shown) provided in the upper gap layer
2
a
5
. The lead-out line
4
c,
is integrally formed continuously from an outermost circumferential end of the coil layers
2
b
4
. The lead-out line
4
d
has a connecting end
4
d
1
at a side of the lower core layer
2
b
1
′ and is connected to a central end N of the coil layers
2
b
4
via a contact hole (not shown) provided in the coil insulating layer
2
b
3
by a lead layer
5
provided on the coil insulating layer
2
b
3
by plating at the same time when the upper core layer
2
b
5
is formed.
The other ends of the individual lead-out lines
4
a,
4
b,
4
c,
and
4
d
are provided with bump connections
4
a
2
,
4
b
2
,
4
c
1
, and
4
d
2
, and bumps (not shown) formed of a Ni—Fe type alloy or Permalloy, or the like are provided thereon. A protective layer
6
formed of Al
2
O
3
or the like is provided on the entire trailing end surface
1
b
of the slider
1
, covering the upper layers, including the upper core layer
2
b
5
, the lead-out lines
4
a,
4
b,
4
c,
and
4
d
and the bumps (not shown), etc. Four bonding pads
3
composed of gold are formed by plating on the upper layers of the four bumps (not shown) that have been partly exposed by polishing the trailing end surface
1
b,
as shown in FIG.
5
and FIG.
9
. Thus, the four bonding pads
3
and the head device
2
are electrically connected to make up the conventional thin film magnetic head.
With an increasing capacity of a magnetic recording device such as a hard disk drive, the slider
1
of a thin film magnetic head is becoming smaller, leading to a necessity for an effective disposition of the bonding pads
3
and the head device
2
in a limited space of the trailing end surface
1
b.
Regarding the head device
2
, a size of the coil layers
2
b
4
is a decisive factor in determining a size or area of the trailing end surface
1
b.
In order to place the head device
2
in the limited space, the coil layers
2
b
4
are formed to have an almost circular shape as shown in
FIG. 9
or an elliptic shape which is slightly compressed laterally or in a track width direction, while it is longer in a vertical direction orthogonal to the track width direction or height dir

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