Thin film interconnect for multicolor IR/CCD

Details Thin film interconnect for multicolor IR/CCD Thin film interconnect for multicolor IR/CCD

1977-09-01

1979-02-06

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 29589, B01J 1700

Patent

active

041376250

ABSTRACT:
A hybrid mosaic IR/CCD focal plane structure is fabricated using planar thin film interconnects. Rows of detectors are formed on an integrated circuit substrate so that the rows of detectors are adjacent to rows of electrical contacts on the integrated circuit. Contact pads are plated onto the rows of contacts and the regions between adjacent rows of detectors are backfilled with an insulating material. The insulating material is then lapped to expose the contact pads and to form an essentially coplanar surface with the detectors. Thin film interconnects are formed over the coplanar surface between the exposed contact pads and detectors in the adjacent row.

REFERENCES:
patent: 3481777 (1969-12-01), Spannhake
patent: 3805375 (1974-04-01), La Combe
patent: 3961414 (1976-06-01), Humphreys

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