Thin film integrated microcircuit

Details Thin film integrated microcircuit Thin film integrated microcircuit

1987-02-02

1988-04-26

Gensler, Paul

Wave transmission lines and networks

Plural channel systems

Nonreciprocal gyromagnetic type

156 89, 156154, 156280, 156294, 333238, H01P 1387

Patent

active

047407620

ABSTRACT:
A microwave integrated circuit is comprised of a ferrite plug in an alumina substrate, fused therein by a glass composition thermally compatible with both plug and substrate, thereby filling any voids at the interface with dielectic material to minimize circuit losses. The method of assembly permits metalizing the substrate after insertion of the plug, minimizing conductive tracking on the substrate, and facilitating alignment of the metalized circuit with the plug.

REFERENCES:
patent: 3456213 (1969-07-01), Hershenov
patent: 3480836 (1969-11-01), Aronstein
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4415871 (1983-11-01), Stern et al.
patent: 4529459 (1985-07-01), Ebata et al.
patent: 4678683 (1987-07-01), Pasco et al.
patent: 4681656 (1987-07-01), Byrum

Affiliated with

Also associated with

Rating

Thin film integrated microcircuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film integrated microcircuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film integrated microcircuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-822117