Thin film forming method, optical film, polarizing film and...

Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...

Reexamination Certificate

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Details

C427S493000, C427S508000, C427S512000, C427S536000, C427S539000

Reexamination Certificate

active

11212887

ABSTRACT:
A method of forming a layer or layers are disclosed which comprises the steps of transporting a substrate having a first surface and a second surface on the side opposite the first surface to a gap formed between a first electrode and a second electrode opposing each other, the second surface having a coefficient of kinetic friction of not more than 0.9; and subjecting the first surface of the substrate to plasma discharge treatment to form the layer at atmospheric pressure or at approximately atmospheric pressure while supplying a reactive gas to the gap.

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Translation of JP 11-236679 A to Yara et al, machine translated from Thomson/Derwent.
Translation of JP 2000-309871 A to Nakao Hitoshi, machine translation from Thomson/Derwent.

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