Thin film forming apparatus and thin film forming method

Details Thin film forming apparatus and thin film forming method Thin film forming apparatus and thin film forming method

2005-08-09

2005-08-09

Purvis, Sue A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C156S285000, C156S230000, C156S381000, C156S583100, C029S729000, C438S455000, C427S147000, C118S058000

Reexamination Certificate

active

06926057

ABSTRACT:
Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.

REFERENCES:
patent: 4869767 (1989-09-01), Robinson et al.
patent: 5017255 (1991-05-01), Calhoun et al.
patent: 5259926 (1993-11-01), Kuwabara et al.
patent: 1 072 954 (2001-01-01), None
patent: 5-80530 (1993-04-01), None
patent: 2001-135634 (2001-05-01), None
patent: 2001-0030001 (2001-04-01), None

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