Thin film forming apparatus and thin film forming method

Details Thin film forming apparatus and thin film forming method Thin film forming apparatus and thin film forming method

2005-07-19

2005-07-19

Lorengo, Jerry A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S583100, C156S381000, C156S542000, C156S556000, C156S583200, C438S455000, C438S458000, C427S096400, C427S146000

Reexamination Certificate

active

06918421

ABSTRACT:
With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.

REFERENCES:
patent: 6092578 (2000-07-01), Machida et al.
patent: 61-231714 (1986-10-01), None
patent: 10-189566 (1998-07-01), None
patent: 11-135761 (1999-05-01), None

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