Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1998-11-24
2000-04-18
Diamond, Alan
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
29819211, 29829834, 29829836, 29829802, 29829806, 118723R, 118723FI, 118723E, 118723I, C23C 1446
Patent
active
060511206
ABSTRACT:
There is provided a thin film forming apparatus in which plasma of high frequency is made of raw material gas in a film forming chamber 7, a thin film is formed on a surface of a substrate 12 in the film forming chamber 7 by the plasma of high frequency, and a characteristic of the thin film is controlled by irradiating ion beams 4 onto the surface of the substrate 12 at the same time, characterized in that: the substrate 12 is composed of a square plate having a regular square surface or a rectangular surface; and the thin film forming apparatus is provided with a high frequency electrode 13 for forming the plasma of high frequency into a cube or a rectangular parallelepiped to cover an overall surface of the substrate 12, on the surface side of the substrate 12.
REFERENCES:
patent: 4885070 (1989-12-01), Campbell et al.
patent: 5435900 (1995-07-01), Gorokhovsky
patent: 5622635 (1997-04-01), Cuomo et al.
Kirimura Hiroya
Kishida Shigeaki
Mikami Takashi
Ogata Kiyoshi
Diamond Alan
Nissin Electric Co. Ltd.
LandOfFree
Thin film forming apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin film forming apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film forming apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2333854