Thin film field effect transistor having an extension portion ac

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257 72, 257294, 349 43, H01L 2904

Patent

active

057124949

ABSTRACT:
A thin film field effect transistor has a hate electrode formed on a glass substrate and a gate insulation film. A channel region, formed of a semiconductor layer, is provided to be opposite to the gate electrode through the gate insulation film, and a pair of source/drain regions, formed of a n-type semiconductor layer, is provided to sandwich the channel region therebetween. An insulation channel protection layer is formed on the channel region. A silicide layer is formed on the source/drain regions, and source/drain electrodes comes in contact therewith. The drain electrode of the source/drain electrodes has an electrode extension portion extending onto the channel protection layer, and being opposite to the channel region through the channel protection layer.

REFERENCES:
patent: 5471330 (1995-11-01), Sarma
patent: 5614731 (1997-03-01), Uchikoga et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film field effect transistor having an extension portion ac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film field effect transistor having an extension portion ac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film field effect transistor having an extension portion ac will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-344538

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.