Thin film field effect transistor having a doped sub-channel reg

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

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257 9, 257221, 257652, H01L 2900, H01L 2978, H01L 2934

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active

055085555

ABSTRACT:
A thin film field effect transistor (1) is formed by an insulating substrate (2,3) carrying a semiconductor layer (4) having a polycrystalline channel region (5) which is passivated to reduce the density of charge carrier traps. Source and drain electrodes (6 and 7) contact opposite ends (5a,5b) of the channel region (5), and a gate electrode (8) is provided at one major surface (4a) of the semiconductor layer (4) for controlling a conduction channel of one conductivity type in the polycrystalline channel region (5) to provide a gateable connection between the source and drain electrodes (6 and 7). An area (50) of the polycrystalline channel region (5) spaced from the electrodes (6,7,8) of the transistor (1) and lying adjacent to the other major surface (4b) of the semiconductor layer (4) is doped with impurities of the opposite conductivity type for suppressing formation of a conduction channel of the one conductivity type adjacent to the other major surface (4b).

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Rodder et al., "Hot-Carrier Effects in Hydrogen Passivated p-Channel Polycrystalline-Si MOSFET's," IEEE Trans. on Electron Devices vol. ED-34 No. 5, May 1987.
J. G. Fossum et al, "Anomalous Leakage Current in LPCVD Polysilicon MOSFET's", IEEE Transactions on Electron Devices, vol. ED-32, No. 9, Sep. 1985, pp. 1878-1884.

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