Thin film fabrication technique for implantable electrodes

Details Thin film fabrication technique for implantable electrodes Thin film fabrication technique for implantable electrodes

1996-05-01

1998-02-24

Bray, W. Donald

Metal working

Method of mechanical manufacture

Electrical device making

29 2535, 29830, 437183, H05K 114

Patent

active

057200998

ABSTRACT:
An elongated implantable electrode assembly includes a set of electrode pads arranged in a pre-selected pattern, and a plurality of longitudinal wires, each wire being connected to at least one pad. The electrode assembly is formed by first depositing the pads on a sacrificial layer, adding wires to the pad, embedding the pads and wires in a carrier and then removing the sacrificial layer. These steps can be performed using photolithographic techniques.

REFERENCES:
patent: 4736521 (1988-04-01), Dohya
patent: 5058250 (1991-10-01), Turnbull
patent: 5504036 (1996-04-01), Dekker et al.
PCT International Search Report -Appl.No.: PCT/AU 96/00043 -- Jan. 31, 1996 .

Affiliated with

Also associated with

Rating

Thin film fabrication technique for implantable electrodes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film fabrication technique for implantable electrodes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film fabrication technique for implantable electrodes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1868373