Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1998-08-03
2000-10-03
Dutton, Brian
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257712, 438109, H01L 2302, H01L 2334, H01L 2144, H01L 2148, H01L 2150
Patent
active
061277258
ABSTRACT:
An electronics module consists generally of a refractory metal sheet coated with a refractory insulator film which in turn is coated with a film of silicon within which thin film transistor electronics circuits are further generated along with interconnection means. Particulate matter is deposited in a desired pattern by a printing process and then fused into smooth thin films by means of an infrared laser. Insulator particles are first deposited onto the refractory metal sheet and then melted and fused into a smooth film adhered to the metal sheet. Silicon particles are next deposited on the insulator film and melted and crystallized into electronic quality silicon film. TFT electronics are next generated in the silicon by well-known means. A plurality of individual modules can be disposed in patches over an extended area both conserving material and providing mechanical flexibility as required by certain applications. Additionally, a plurality of individual modules can be arranged in a stack together with interconnection and cooling means resulting in a three-dimensional VLSI integrated circuit.
REFERENCES:
patent: 4788627 (1988-11-01), Ehlert et al.
patent: 4896205 (1990-01-01), Weber
patent: 4926242 (1990-05-01), Itoth et al.
patent: 5587882 (1996-12-01), Patel
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