Thin-film electronic circuit unit

Details Thin-film electronic circuit unit Thin-film electronic circuit unit

1981-12-28

1984-01-03

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361403, 361411, H05K 109

Patent

active

044244096

ABSTRACT:
A tantalum layer (2) is formed on an insulating substrate and etched to produce two connecting patterns, a first defining a resistance network and the second defining connection paths and contact areas. The second pattern is provided with metallization, either in a single nickel layer or in a nickel layer provided between thin copper layers, the metallization being of the order of a few tenths of a micron. Instead of providing a soft solder layer directly on the metallization, however, a copper layer at least to 2 microns thick is first put on to provide reinforcement and high conductivity. When the contact areas are provided with a soft solder top coating, it is possible to connect additional components to the unit by dipping into flowing solder without impairing the conductivity of the connection paths. Wire bonding to the contact areas can be accomplished if the contact areas are provided with an outer layer of gold.

REFERENCES:
patent: 2294482 (1942-09-01), Seigmund
patent: 3436605 (1969-04-01), Landron
patent: 3786172 (1974-01-01), Conley
patent: 4075416 (1978-02-01), Kuttner et al.
patent: 4104111 (1978-08-01), Mack
patent: 4109297 (1978-08-01), Lesh et al.

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