Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1990-09-25
1992-05-19
Nguyen, Nam X.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20419231, 118723, C23C 1650
Patent
active
051145596
ABSTRACT:
A thin film deposition system includes an evacuated casing in which there is introduced an active gas or an inert gas or a mixture thereof. An evaporant carried by an evaporation source in the evacuated casing is evaporated and travels toward a substrate supported on the electrode. A filament for emitting thermions is disposed between the evaporation source and the electrode, and a grid for passing the evaporated material therethrough is disposed between the filament and the electrode. Power supplies are electrically connected to the evacuated casing, the evaporation source, the electrode, the filament, and the grid, for keeping the filament negative in potential with respect to the evacuated casing and the grid. Alternatively, the evacuated casing may not be connected to the power supplies so that the grid is kept positive with respect to the filament. The grid may be of a double-layer structure, with the gas inlet means connected to the grid.
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Kinoshita Mikio
Nakazawa Masashi
Ohta Wasaburo
Nguyen Nam X.
Ricoh & Company, Ltd.
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