Thin film deposition system

Details Thin film deposition system Thin film deposition system

1990-10-22

1995-06-27

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118723HC, C23C 1434, C23C 1448

Patent

active

054276683

ABSTRACT:
A thin film deposition system includes a vacuum or evacuated casing in which there is introduced an active gas or an inert gas or a mixture thereof. A filament emits thermions which impinge upon gas molecules to ionize them into positive ions. The ions bombard a target, from which particles are emitted toward a substrate. The particles emitted from the target are also ionized by the thermions. In the vicinity of a grid, more particles from the target are ionized by thermions which are vertically oscillated and ionized molecules of the gas. The ions are accelerated toward the substrate and bombard the substrate, thereby depositing a thin film thereon. The thin film deposition system may additionally have an evaporation source for supporting an evaporant which emit particles to be deposited on the substrate.

REFERENCES:
patent: 3372071 (1968-03-01), Wisman et al.
patent: 3390025 (1968-06-01), Strieter
patent: 3583361 (1971-06-01), Laudel
patent: 3713911 (1973-01-01), Larkin et al.
patent: 4389299 (1983-06-01), Adachi et al.
patent: 4415421 (1983-11-01), Sasanuma
patent: 4418283 (1983-11-01), Trotel
patent: 4504558 (1985-03-01), Bohlen et al.
patent: 4520269 (1985-05-01), Jones
patent: 4717644 (1988-01-01), Jones et al.
patent: 4743766 (1988-05-01), Nakasuji et al.
patent: 4854265 (1989-08-01), Ohta et al.
patent: 4960072 (1990-10-01), Ohta et al.

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