Thin film deposition by electric and magnetic crossed-field diod

Details Thin film deposition by electric and magnetic crossed-field diod Thin film deposition by electric and magnetic crossed-field diod

1978-12-18

1980-06-24

Kendall, Ralph S.

Coating processes

Electrical product produced

Electron emissive or suppressive

4271261, 427109, 427255, 204192SP, 4272481, 4272552, H01J 4328, B05D 512

Patent

active

042095522

ABSTRACT:
Applying a thin film coating to the surface of a workpiece, in particular, applying a coating of titanium nitride to a klystron window by means of a crossed-field diode sputtering array. The array is comprised of a cohesive group of numerous small hollow electrically conducting cylinders and is mounted so that the open ends of the cylinders on one side of the group are adjacent a titanium cathode plate. The workpiece is mounted so as to face the open ends of the other side of the group. A magnetic field is applied to the array so as to be coaxial with the cylinders and a potential is applied across the cylinders and the cathode plate, the cylinders as an anode being positive with respect to the cathode plate. The cylinders, the cathode plate and the workpiece are situated in an atmosphere of nitrogen which becomes ionized such as by field emission because of the electric field between the cylinders and cathode plate, thereby establishing an anode-cathode discharge that results in sputtering of the titanium plate. The sputtered titanium coats the workpiece and chemically combines with the nitrogen to form a titanium nitride coating on the workpiece. Gas pressure, gas mixtures, cathode material composition, voltages applied to the cathode and anode, the magnetic field, cathode, anode and workpiece spacing, and the aspect ratio (ratio of length to inner diameter) of the anode cylinders, all may be controlled to provide consistent optimum thin film coatings of various compositions and thicknesses. Another facet of the disclosure is the coating of microwave components per se with titanium nitride to reduce multipactoring under operating conditions of the components.

REFERENCES:
patent: 3309302 (1967-03-01), Heil
patent: 3891884 (1975-06-01), Tisdale

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