Thin film deposition as an active conductor and method therefor

Details Thin film deposition as an active conductor and method therefor Thin film deposition as an active conductor and method therefor

2008-05-20

2008-05-20

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S818000, C174S034000, C174S051000, C257S665000, C257S666000

Reexamination Certificate

active

07375982

ABSTRACT:
A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering. An apparatus includes a first substrate assembly including a first substrate having a cavity. A first set of electronic components are disposed within the cavity, and a first polymer is disposed over the first set of components. Deposited on an outer surface of the first polymer by vapor deposition is a thin film of metal. The thin film of metal is electrically coupled with a ground. A second substrate assembly including a second substrate is coupled with the first substrate assembly.

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